QFN PCB Assembly

QFN packages are similar to BGA packages, but they have a smaller footprint and do not have the solder balls on the bottom. Instead, the leads are located on the sides of the package, making it easier to mount and rework. This makes QFN packages an ideal choice for high-density electronic applications where space is at a premium.

About Our Products

Our QFN PCB assembly process is designed to meet the most stringent quality standards. We use the latest technology and equipment to ensure the highest level of precision and accuracy in the assembly process. Our state-of-the-art QFN rework stations and X-ray inspection machines allow us to detect any defects or anomalies in the assembly process, ensuring that every product that leaves our facility is of the highest quality.

Our QFN PCB assembly services also include a comprehensive range of testing and inspection procedures to ensure that the final product meets all the necessary specifications. This includes functional testing, thermal cycling, and burn-in testing, among others.

With our QFN PCB assembly services, you can be assured of a reliable and high-performance product that meets your exact requirements. Whether you need a prototype or a large-scale production run, we have the expertise and resources to deliver on time and within budget.

In conclusion, QFN PCB assembly is the future of high-density electronics. With our expertise and state-of-the-art equipment, we can help you design and manufacture a product that meets your exact requirements and exceeds your expectations. Please feel free to Contact us to learn more about our QFN PCB assembly services.